 | International Test Solutions provides non-destructive cleaning products used by semiconductor manufacturers to remove debris and contaminants generated during wafer level and burn-in/test socket testing. By removing loose debris and adherent contaminants in-line, the quality of the testing data is improved, the test equipment downtime is reduced, throughput is increased and manufacturing yields are improved. |
 | PROBE CLEAN™ Removes Loose Debris From Probe Tips
Probe Clean™ is a unique highly cross-linked polymeric probe card cleaning material that is non-conductive, non-corrosive material that removes and traps the loose debris that accumulates on the probe tips and shaft. |  |  | PROBE POLISH™ Non-destructively Maintains High Wafer Yield
Probe Polish™ combines the attractive forces of Probe Clean™ with uniformly and spatially distributed abrasive particles for the added benefit of removing embedded contaminants during probe cleaning. | |
 | PROBE SCRUB™ Restores Performance and Removes Bonded Debris
Probe Scrub™ is a multilayer probe cleaning medium developed for collecting particulates and debris that accumulate on probes during wafer sort and effectively removing "weld nuggets" from the probe tip contact surface. |  | PROBE LAP™ Precision Lapping Film
Probe Lap™ is a precision lapping film developed for on-line probe card cleaning to impart a proper contact surface finish with significantly reduced debris generation and provide consistent contaminant removal across a wide temperature range (ambient up to 125oC |
Flat Tip Probes  | PROBE FORM™ Reshapes Probes for Stable Contact Resistance
Probe Form™ was developed for cantilevered probe technologies to provide a cost effective method of uniformly “reforming” a flat probe tip into a smooth, radius shape. |  |  | TEST CELL CONDITIONER (TCC) Collects Loose Debris and Removes Adherent Contaminants From Test Sockets and Contactors
Test Cell Conditioner (TCC) is a unique multilayered “surrogate” package form-factor designed to fit any IC burn-in/test socket and remove all loose debris and embedded oxides from the contacts and test socket. |  |
Link to manufacturers web site: http://inttest.net
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