Sistem Technology

LIFT-OFF CLUSTER
containing 3 process modules

We proudly announce the delivery of the first fully automated Lift-Off Cluster containing 3 process modules.

The tool is based on our versatile and reliable Maximus 804 platform which could be equipped with Spin Coater, Developer, Hot/Cold Plate, HMDS-Primer and Lift-Off processing Modules.

Immersion batch soak is included as well as the Lift-Off processing chamber and Post Lift-Off Cleaning station.

• The module for Immersion Batch Soak with single wafer loading could be optionally equipped with mega- or ultrasonic agitation as well as a carrier.
• High pressure and soak nozzles for hot chemicals (e.g. NMP) provide superior results in the Lift-Off chamber.
• The Post Cleaning station provides a variety of front and backside cleaning options according to customer device requirements.

3 Module configuration, independent Wet and Dry Handling, Batch Mode for Soak process, NMP-recirculation and metal reclaim provide an excellent CoO.

Applications include Metal Lift-Off for various MEMS applications, Solar Cell production (High Efficiency Concentrator Cells), Optical Infrared Sensors, Optoelectronics, Resist Stripping, Flux Removal and more.

Si wafers and III-V semiconductors including GaAs, InP, GaN, GaP, Sapphire and SiC and Glass wafers from 4” to 8” can be handled, 2 sizes are pre-selectable without changeover.