|May2009: ATMsse introduces first fully automated LIFT-OFF PROCESSING MODULES|
We proudly announce the delivery of the first fully automated Lift-Off Cluster containing 3 process modules.
The tool is based on our versatile and reliable Maximus 804 platform which could be equipped with Spin Coater, Developer, Hot/Cold Plate, HMDS-Primer and Lift-Off processing Modules.
Immersion batch soak is included as well as the Lift-Off processing chamber and Post Lift-Off Cleaning station.
3 Module configuration, independent Wet and Dry Handling, Batch Mode for Soak process, NMP-recirculation and metal reclaim provide an excellent CoO.
Applications include Metal Lift-Off for various MEMS applications, Solar Cell production (High Efficiency Concentrator Cells), Optical Infrared Sensors, Optoelectronics, Resist Stripping, Flux Removal and more.
Si wafers and III-V semiconductors including GaAs, InP, GaN, GaP, Sapphire and SiC and Glass wafers from 4” to 8” can be handled, 2 sizes are pre-selectable without changeover.