Atomic Layer Deposition

Picosun is the leading supplier of high-quality Atomic Layer Deposition (ALD) thin film coating solutions from fully automated, SEMI-compliant batch and cluster systems for high volume manufacturing to smaller scale R&D and pre-pilot production tools. Production-proven coating solutions for the semiconductor industry, 3D object coating, MedTech and many more. Memory, MEMS, logic, LED & OLED, sensor, power device, battery, and 3D component processing with leading quality, reliability, and operational agility. Comprehensive process support, and the best customer care make Picosun the trusted partner in your ALD journey from day one until the start of your production.

The PICOSUN® P-1000 ALD system is designed for coating of various 3D items up to 450mm x 650mm, in a production environment. Items could typically include mechanical machinery parts, glass or metal sheets, coins, watch parts and jewellery, lenses, optics as well as medical devices and implants (PicoMEDICAL™ solutions). Main applications include passivation and barrier layers to significantly improve performance/lifetime of coated items.

The PICOSUN® P-1000 ALD system offers innovative and agile design to enable the highest quality ALD depositions with excellent uniformity, maximum yields, minimum system downtime and low cost-of-ownership with production-proven processes.

The reliable, fast, and easy to maintain PICOSUN® P-1000 ALD system represents the cutting-edge of industrial ALD.

Technical features

Processing temperature and capacity

• 50 - 400°C

Typical processes

• Al2O3, ZnO, TiO2

Precursors

• Liquid, solid, gas, ozone
• Level sensors, cleaning and refill service
• Up to 10 sources with 6 separate inlets

The PICOSUN® R-200 Standard ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewellery, coins, and medical implants.

The agile design enables the highest quality ALD film depositions together with the ultimate flexibility of the system to fit future needs and applications. The patented hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples can be achieved thanks to the proprietary Picoflow™ technology. The PICOSUN® R-200 Standard systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Integration with glove boxes, powder chambers, and various in situ analytics systems enable efficient and flexible research with good results, no matter what your research area is now or in the future.

The unique scalability of the Picosun R-series tools enables smooth transition of the research results into production with Picosun P-series ALD systems. The PICOSUN® R-200 Standard ALD system is the market leader in thermal ALD research tools. It has become the tool of choice both for companies and research institutions driven by innovation.

Technical features

Typical substrate size and type

• 50–200 mm single wafers
• 156 mm x 156 mm solar Si wafers
• 3D objects
• Powders and particles
• Mini-batch
• Porous, through-porous, and high aspect ratio (up to 1:2500)

Processing temperature

• 50 - 500°C

Typical processes

• Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZnO, ZrO2, TiN, AlN, metals such as Pt or Ir

Substrate loading

• Manual loading with a pneumatic lift
• Load lock with magnetic manipulator arm

Precursors

• Liquid, solid, gas, ozone
• Up to 6 sources with 4 separate inlets

Options

• Picoflow™ diffusion enhancer, RGA, N2 generator, gas scrubber, customized designs, glove box compatibility for inert loading

The PICOSUN® R-200 Advanced ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewellery, coins, and medical implants.

The agile design enables the highest quality ALD film depositions together with the ultimate flexibility of the system to fit future needs and applications. The patented hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples can be achieved thanks to the proprietary Picoflow™ technology. The PICOSUN® R-200 Advanced systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Highly efficient and patented remote plasma option enables deposition of metals without the risk of short-circuiting or plasma damage. Integration with glove boxes, UHV systems, manual and automated loaders, cluster tools, powder chambers, roll-to-roll chambers, and various in situ analytics systems enable efficient and flexible research with good results no matter what your research area is now or in the future.

The unique scalability of the Picosun R-series tools enables smooth transition of the research results into production with Picosun P-series ALD systems. The PICOSUN® R-200 Advanced ALD system is the global market leader in thermal ALD research tools with hundreds of installations. It has become the tool of choice both for companies and research institutions driven by innovation.

Technical features

Typical substrate size and type

• 50–200 mm single wafers
• 156 mm x 156 mm solar Si wafers
• 3D objects
• Powders and particles
• Mini-batch
• Porous, through-porous, and high aspect ratio (up to 1:2500)

Processing temperature

• 50 - 500°C , plasma 450°C (650 °C with heated chuck on request)

Typical processes

• l2O3, TiO2, SiO2, Ta2O5, HfO2, ZnO, ZrO2, AlN, TiN, metals such as Pt or Ir

Substrate loading

• Manual loading with a pneumatic lift
• Load lock with magnetic manipulator arm
• Semi-automatic loading with handling robot
• Cassette-to-cassette loading with cluster tools

Precursors

• Liquid, solid, gas, ozone, plasma(*)
• Up to 12 sources with 6 separate inlets (7 if the plasma option is chosen)

Options

• Cluster tools, Picoflow™ diffusion enhancer, roll-to-roll chamber, RGA, UHV compatibility, N2 generator, gas scrubber, customized designs, glove box integration for inert loading

Plasma generator technical features

• Remote plasma source mounted to the loading chamber with connection to the reaction chamber
• Sapphire applicator for different chemistries at superior particle performance
• Commercial microwave plasma generator with adjustable 300 - 3000W power, 2.45 GHz frequency
• Protective gas flow in the intermediate space (no back-diffusion of the plasma species)
• Possibility for plasma and thermal ALD cycling during the same deposition run, without hardware changes to the system
• The following relevant standards were used for evaluation of compliance of the power supply: DIN EN ISO 12100:2011-03, DIN EN 60204-1:2007-06, DIN EN 61000-6-2:2006-03, DIN EN 61000-6-4:2011-09
• The power supply has been developed and manufactured to meet the requirements stipulated in SEMI S2-0310

The PICOSUN® P-300B ALD system is specially designed for production of MEMS devices such as print heads, sensors, and microphones, and coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewellery, lenses, optics, and medical devices and implants. The agile design, with easy and fast maintenance, ensures minimum system downtime and lowest cost-of-ownership in the market. Picosun’s proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

Technical features

Typical substrate size and type

• 200 mm wafers in batches of 25 pcs (standard pitch)
• 150 mm wafers in batches of 50 pcs (standard pitch)
• 100 mm wafers in batches of 75 pcs (standard pitch)
• All kinds of 3-dimensional items such as mechanical machinery parts, coins, watch parts and jewellery, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL® solutions)
• High aspect ratio samples (up to 1:2500)

Processing temperature and capacity

• 50 - 500°C

Typical processes

• Batch processes available with cycle times down to single digit seconds
• Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
• Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)

Substrate loading

• Manual loading with a pneumatic lift
• Linear semi-automatic loading
• Industrial robot loading

Precursors

• Liquid, solid, gas, ozone
• Level sensors, cleaning and refill service
• Up to 8 sources with 4 separate inlets

The PICOSUN® P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones. The PICOSUN® P-300BV ALD system represents the cutting-edge of industrial ALD. The system is designed for semi-automated handling of wafer batches. The tool is optimised for fast batch production and it can be integrated to factory automation via SECS/GEM option. Vacuum loading system with heating option enables clean processing of sensitive substrates and deposition of materials such as metal nitrides.

The PICOSUN® P-300BV is the ALD system of choice for innovation driven industries.

Technical features

Typical substrate size and type

• 200 mm wafers in batches of 25 pcs (standard pitch)
• 150 mm wafers in batches of 50 pcs (standard pitch)
• 100 mm wafers in batches of 75 pcs (standard pitch)
• 100 mm wafers in batches of 100 pcs (standard pitch)
• Non-wafer substrates (tailored holders)
• High aspect ratio samples (up to 1:2500

Processing temperature and capacity

• 50 - 450°C

Typical processes

• Batch processes available with cycle times down to single digit seconds
• Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
• Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)

Substrate loading

• Semi-automatic loading with vertical loaders (one or two loaders)
• Optional heating for load lock

Precursors

• Liquid, solid, gas, ozone
• Level sensors, cleaning and refill service
• Up to 8 sources with 4 separate inlets