Applications

Thin film deposition lays down layers of metal, dielectric or carbon, from a few nanometres to several microns thick. SiSTEM supplies Intlvac's deposition systems, from compact R&D tools to production platforms, in the UK, Ireland and most of Europe.

Ion beam etching removes material with a broad beam of inert gas ions, so it etches metals, oxides and compounds that chemical etching struggles with. SiSTEM supplies Intlvac's Nanoquest ion beam etch and milling systems in the UK, Ireland and most of Europe.

Ion beam sputter deposition uses a separate ion source to sputter a target at low pressure, giving dense, smooth, low-particle films for optics and semiconductors. SiSTEM supplies Intlvac's IBSD systems in the UK, Ireland and most of Europe.

Indium bumps join two chips face to face in flip-chip bonding, such as an infrared detector array and its readout circuit. SiSTEM supplies Intlvac's Icarus system, which evaporates indium bumps in production, in the UK, Ireland and most of Europe.

Additive printing of conductive and quantum dot inks in lines down to 500 nm, without masks or UV exposure. Hummink's NAZCA printer, supplied by SiSTEM.

SMIF loaders and pod openers, 300mm FOUP load ports, wafer sorters, EFEMs, robots and reticle handling from Fortrend, supplied, installed and serviced across the UK, Ireland and Europe.

Wafer processing equipment coats, develops, bakes, cleans and bonds wafers on their way through a fab. SiSTEM supplies tools for each step from CEE, C&D Semiconductor, Modutek and Process Technology, to research cleanrooms and production lines.

Optical defect inspection finds particles, scratches, resist striations and focus spots on a wafer by eye and under the microscope. SiSTEM supplies C&D Semiconductor's inspection and defect review systems.

SiSTEM services atomic layer deposition (ALD) systems, with most of our work on Picosun R-series and P-series tools, including after Applied Materials ends its own service on 31 October 2026.

Temporary bonding holds a thin or fragile device wafer on a carrier through thinning and backside processing, then releases it cleanly. SiSTEM supplies CEE's Apogee temporary wafer bonder and its thermal slide and mechanical debonders across the UK and Europe.

Laser micromachining for sample preparation, annealing, dicing and link trimming, with 3D-Micromac systems, process trials in Chemnitz and support in the UK and Ireland.

Laser preparation of specimens for TEM, FIB/SEM, atom probe and micromechanical testing, from single samples to full 300 mm wafers, with 3D-Micromac microPREP.

A semiconductor wet bench is where wafers are cleaned, etched, rinsed and dried in liquid chemistry. SiSTEM supplies Modutek wet benches across the UK and Europe, from manual stations to fully automated lines, alongside CEE's X-Pro II for lithography.

Inline heaters for DI water, acids, solvents and nitrogen on wet benches and cleaning lines, chosen by what the liquid touches.

Replacement heating elements for diffusion furnaces, wafer curing ovens up to 450°C and inline process heaters, from DS Fibertech, Fortrend and Process Technology.

Thermal vacuum testing checks that flight hardware works under space vacuum and through hot and cold extremes before it's launched. SiSTEM supplies Intlvac's TVAC chambers and Aether vacuum degassing system in the UK, Ireland and most of Europe.

Megasonic cleaning uses sound at 850 kHz to 2 MHz to lift sub-micron particles off wafers with less risk to patterned features. SiSTEM supplies Modutek wet benches with megasonic tanks across the UK and Europe.

Post-CMP cleaning removes slurry residue and contamination left after CMP, and has a direct effect on yield and process stability. SiSTEM supplies Purience PVA brushes and Modutek megasonic wet benches for applications including HBM and hybrid bonding.

SiSTEM Technology stock a wide range of vacuum chambers, valves, and vacuum traps for the semiconductor and all other types of industries where vacuum plays a part in the manufacturing and/or testing process.

Silicon, silicon carbide, compound and specialty wafers from D&X, in stock sizes or made to specification, for research, process development and production.

Chuck cleaning wafers clear particles from etch, deposition, lithography and prober chucks in minutes, without opening the tool. Laminated and spin-coated wafers from 75 mm to 300 mm, supplied in the UK and Ireland.

Dicing, back-grinding and bump tape from D&X, UV and non-UV, made in Japan for silicon, glass, ceramics and packaging substrates.

Probe card cleaning films and chuck cleaning wafers for wafer test, to keep contact resistance stable and prober chucks free of particles. Supplied in the UK and Ireland.

Degassing systems play a critical role in component manufacturing by effectively eliminating trapped gases, including air and volatile substances. These specialised systems are meticulously designed to ensure the utmost performance, quality, and durability of components across a range of industries such as electronics, aerospace, automotive, and manufacturing. Their indispensable presence guarantees optimal outcomes throughout the production process.

SiSTEM Technology specialises in top-quality spares and consumables for the semiconductor and high-tech manufacturing sectors. We offer a wide range of products, from Preventive Maintenance Spares Kits to Furnace Elements to Chuck Cleaning Wafers.