Applications

Thin film deposition tools for physical vapour deposition, chemical vapour deposition, and atomic layer deposition are highly specialised, and play a pivotal role in creating thin films that serve as the bedrock for an array of electronic devices, including integrated circuits, solar cells, and displays.

Ion Beam Etching (IBE) and Ion Beam Milling (IBM) stand as pivotal techniques, offering unparalleled precision and control in the creation and modification of thin films.

Ion Beam Sputtering (IBS) is a form of Physical Vapour Deposition (PVD) also known as Ion Beam Sputter Deposition (IBSD). It is done by directing an ion beam source towards a target, sputtering atoms/molecules for deposition on a substrate. IBS boasts unparalleled advantages, offering a realm of possibilities across various industries such as optics, sensors (MEMS), thin film solar cells, and semiconductors.

Seamlessly apply any material onto any surface, enjoying unparalleled design flexibility. High Precision Capillary Printing (HPCAP) delivers bespoke, localised manufacturing at both the micron and sub-micron levels without the need for masks, UV or chemical reactions.

Our extensive range of handling and automation equipment includes retrofit open-cassette tools, SMIF pod load/unload systems, 300mm FOUP solutions, sorters, EFEMs, mass wafer and reticle transfer systems, reticle storage and handling solutions, Vacuum Transfer Modules (VTMs), and advanced robots and robotic arms.

Wafer processing equipment is fundamental to modern microfabrication, enabling precision in semiconductor, nanotechnology, and biotechnology R&D and manufacturing. Our advanced tools include spin coaters, spin developers, bake plates, and temporary wafer bonders and debonders. We also offer track and cluster photolithography processing tools.

Temporary bonding holds a thin or fragile device wafer on a carrier through thinning and backside processing, then releases it cleanly. SiSTEM supplies CEE's Apogee temporary wafer bonder and its thermal slide and mechanical debonders across the UK and Europe.

Laser micromachining for sample preparation, annealing, dicing and link trimming, with 3D-Micromac systems, process trials in Chemnitz and support in the UK and Ireland.

Laser preparation of specimens for TEM, FIB/SEM, atom probe and micromechanical testing, from single samples to full 300 mm wafers, with 3D-Micromac microPREP.

We supply customised manual or automated wet benches with chemical baths, spin processors, and rinse systems, facilitating cleaning, etching, and the development photoresist layers, with precise control to achieve desired results.

Water and chemical heaters are specialised devices designed to provide precise, uniform heating for various substances across laboratories, industrial processes, and research settings. Integral safety features and temperature controllers ensure secure and accurate temperature control, given the temperature sensitivity of many processes.

Meticulously designed, these products are the epitome of precise and uniform temperature control. By maintaining consistent process conditions, they unlock the ability to produce components and devices of unparalleled quality.

Precision engineered thermal vacuum chambers for high-performance vacuum and temperature control. Our products incorporate cutting-edge materials and technologies, such as cryogenic and resistive heating systems, to provide accurate and uniform temperature profiles and vacuum levels.

We provide a comprehensive selection of high-performance megasonic products that consistently deliver exceptional cleaning performance while minimising the risk of damage to delicate components. These products ensure superior and reliable cleaning results, meeting the stringent requirements of sensitive components.

Post-CMP cleaning is critical to semiconductor manufacturing, helping remove slurry residue, metallic contaminants and microscopic particles following CMP processing. Advanced wafer cleaning technologies support contamination control, improved yield, process stability and next-generation semiconductor packaging applications including HBM and hybrid bonding.

SiSTEM Technology stock a wide range of vacuum chambers, valves, and vacuum traps for the semiconductor and all other types of industries where vacuum plays a part in the manufacturing and/or testing process.

Silicon, silicon carbide, compound and specialty wafers from D&X, in stock sizes or made to specification, for research, process development and production.

Through the maintenance of clean chucks, processing equipment longevity can be extended, mitigating the requirement for premature replacements or costly repairs. Moreover, the enhanced yield and superior product quality achieved through cleaner chucks can lead to heightened customer satisfaction, amplified market competitiveness, and ultimately, increased revenue.

Dicing, back-grinding and bump tape from D&X, UV and non-UV, made in Japan for silicon, glass, ceramics and packaging substrates.

We offer essential solutions that enable semiconductor device manufacturers, foundries, and OSATs (Outsourced Semiconductor Assembly and Test) to achieve exceptional yield rates, minimize downtime, and realise significant cost savings.

Degassing systems play a critical role in component manufacturing by effectively eliminating trapped gases, including air and volatile substances. These specialised systems are meticulously designed to ensure the utmost performance, quality, and durability of components across a range of industries such as electronics, aerospace, automotive, and manufacturing. Their indispensable presence guarantees optimal outcomes throughout the production process.

SiSTEM Technology specialises in top-quality spares and consumables for the semiconductor and high-tech manufacturing sectors. We offer a wide range of products, from Preventive Maintenance Spares Kits to Furnace Elements to Chuck Cleaning Wafers.