Wafer Processing Equipment
Welcome to the forefront of semiconductor, nanotechnology and biotechnology wafer processing equipment innovation – your gateway to precision and excellence in demanding applications from R&D through to manufacturing. SiSTEM Technology has the great pleasure of distributing wafer processing equipment from Cost Effective Equipment, who lead the industry with their high-precision wafer process tools, offering a comprehensive range of solutions including spin coaters, spin developers/cleaners, bake plates, temporary wafer bonders, and wafer debonders.
Our CEE spin coaters and hotplates are trusted by experts worldwide for their exceptional performance in applications such as photoresist and anti-reflective coatings, e-beam resists, sol-gels, packaging adhesives, dielectrics, and more. With decades of experience in coating and baking semiconductor wafers, MEMS devices, flat panel displays, photomasks, and bio-medical devices, our CEE products offer unparalleled flexibility and reliability.
- Cutting-Edge Technology: Our equipment incorporates the latest advancements in semiconductor wafer processing, ensuring you stay at the forefront of the industry.
- Precision and Consistency: Achieve production-quality results with our equipment, eliminating the need for costly rework.
- High Reliability: Our spinners feature digital indirect spindle drive technology, addressing common issues like chuck heating and motor reliability.
- Comprehensive Support: From spin chucks to automatic dispense systems and programmable exhaust controls, we offer a wide range of accessories to enhance your processes.
- Spin Development Excellence: Our spin-develop systems provide stable and repeatable pattern development, suitable for the most demanding applications.
- Industry-Standard Bake Plates: Our bake plates deliver uniformity and repeatability, eliminating process variables.
- Customised Solutions: The Cee® X-Pro-II Workstation offers an integrated approach to wafer processing, designed to fit your specific needs.
We understand that consistency and yield are paramount in semiconductor manufacturing, which is why top semiconductor, nanotechnology & biotechnology researchers and manufacturers worldwide specify CEE equipment for their cleanrooms and laboratories.
Cost Effective Equipment Apogee® Temporary Bonders and Debonders are designed to protect your high-value substrates, offering void-free vacuum bonding and Total Thickness Variation (TTV) control. The Cee® 1300CSX Thermal Slide Debonder provides a significant improvement over chemical release debonding, while Apogee® Mechanical Debonding minimises thermal and mechanical stress. These tools are especially suited for compound semiconductors, wafer-thinning processes, and wafer-level packaging.
Let our team of experts assist you in selecting the right materials, processes, and equipment to meet your unique requirements. Say goodbye to the hassle of sourcing from multiple vendors – our Cee® X-Pro-II Workstation offers a fully integrated solution, customised to your wafer processing needs.
Experience the future of semiconductor wafer processing with SiSTEM Technology and Cost Effective Equipment.
Contact us today, and let’s embark on a journey of innovation and excellence together!