- Full-size or half-size cabinet for coat, develop and bake modules
- Choice of ducted exhaust, fan filter unit (laminar downflow) or ductless recirculation top
- Installation and training arranged and quoted, delivered by our UK and European after-sales team
- Waste bottle containment with optional drain bottles
- Exhausted drawer for material storage and pressure vessels
- Sash for a clean environment, fume containment and operator safety
- CE marked
Email: info@sistemtechnology.com Call: +44 (0)1327 362 844
Cost Effective Equipment (CEE)
Cost Effective Equipment designs and builds wafer processing equipment in St. James, Missouri, and has served the semiconductor industry since 1987. The Apogee range covers spin coaters, spin developers and bake plates for substrates up to 450 mm. CEE also makes the X-Pro II cleanroom workstation and a set of tools for temporary bonding and debonding, used in research cleanrooms and low-volume production.
CEE tools are very popular with universities and research institutes across the UK and Europe, and with spin-out companies setting up their first cleanroom processes. Labs we supplied in 2018 still order chucks and spares from us.
If a tool goes down, we stay on the fault with CEE until you confirm it’s working properly again. Contact us to talk through your process, or browse the range below.
Built in Missouri since 1987
CEE designs and builds its tools in St. James, Missouri, and every one is CE marked. Remote technical support and application process assistance come with every tool for as long as you run it.Apogee spin and bake tools
Benchtop spin coaters and spin developers take substrates up to 200 mm, or 450 mm in the larger models. Apogee bake plates reach 300°C, or 400°C as an option, on substrates up to 300 mm.X-Pro II workstation
One cleanroom cabinet holds Apogee modules with fume control and chemical storage built in. It comes in full or half size, with a choice of three tops for exhaust and airflow.Temporary bond and debond
The Apogee bonder bonds device wafers to carriers under vacuum for thinning and backside work. Afterwards, a thermal slide debonder or a room-temperature mechanical debonder separates them.Process data on every run
DataStream logs each run on every Apogee tool, with recipes and logs moved over USB or Ethernet. Recipes take unlimited steps, timed to 0.1 seconds.Supplied and supported by SiSTEM
SiSTEM supplies every CEE tool across the UK and Europe and handles the one-year parts-and-labour warranty in territory, with CEE's engineers behind us on every fault.Products from Cost Effective Equipment
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X-Pro II Workstation
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Apogee 200 Spin Coater
- Benchtop spin coater with a compact footprint
- Wafers up to 200 mm round and squares up to 6” x 6”
- Spin speed up to 12,000 rpm, repeatable to 0.2 rpm
- High-density polyethylene (HDPE) spin bowl
- Full-colour 7-inch touchscreen
- Benchtop, flange or deck mounting
- Fits the X-Pro II workstation
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Apogee 450 Spin Coater
- Benchtop spin coater for large substrates
- Wafers up to 450 mm round and squares up to 14” x 14”
- Spin speed up to 6,000 rpm, repeatable to 0.2 rpm
- Indirect drive keeps the motor out of the chemical path
- Full-colour 7-inch touchscreen
- Benchtop, flange or deck mounting
- Fits the X-Pro II workstation
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Apogee 200 Spin Developer
- Benchtop spin developer for wafers up to 200 mm and squares up to 6” x 6”
- Spray or stream developer dispense
- Top and backside DI water rinse
- Spin speed up to 12,000 rpm
- Optional nitrogen blow-off
- Fits the X-Pro II workstation
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Apogee 450 Spin Developer
- Benchtop spin developer for wafers up to 450 mm and squares up to 14” x 14”
- Fanjet spray, side-angle puddle and stream dispense
- Up to four spray or stream nozzles
- Optional auto-drain separator
- Benchtop, flange or deck mounting
- Fits the X-Pro II workstation
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Apogee 200 Bake Plate
- Benchtop bake plate for wafers up to 200 mm and squares up to 8” x 8”
- Ambient to 300°C, or 400°C as an option
- ±0.3% uniformity across the working surface
- Contact, vacuum or proximity baking
- Smart Pins set the proximity height under program control
- Cool-touch exhausted stainless steel hood
- Benchtop or flange mounting; fits the X-Pro II workstation
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Apogee 300 Bake Plate
- Bake plate for wafers up to 300 mm and squares up to 12”
- Ambient to 300°C, or 400°C as an option
- ±0.3% uniformity across the working surface
- Contact, vacuum or proximity baking
- Smart Pins set the proximity height under program control
- Cool-touch exhausted stainless steel hood
- Benchtop, flange or deck mounting; fits the X-Pro II workstation
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Apogee Temporary Wafer Bonder
- Vacuum bonding of device wafers to carrier substrates
- Substrates from 2” to 300 mm
- Two heated platens, independently controlled to 300°C
- Bond force 550 to 12,000 N
- Wafers held apart until the chamber is evacuated, keeping voids out of the bond line
- DataStream logs every bond cycle
- CE marked
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Apogee Thermal Slide Debonder
- Semi-automated thermal slide debonder for wax and thermoplastic adhesives
- Substrates from 2” to 200 mm
- Two heated platens, independently controlled to 300°C
- Recipe-controlled slide force (1 to 100 N) and speed
- DataStream logs force and cycle time for every wafer
- Replaces CEE’s earlier 1300CSX slide debonder
- CE marked
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Mechanical Wafer Debonder
- Room-temperature peel debonding of temporarily bonded wafer pairs
- Substrates from 50 mm to 200 mm, device wafer on film frame
- Peel force 1 to 75 N, set by recipe
- Up to 20 wafers an hour
- Excess force sensing stops the peel automatically
- DataStream logs force and cycle time for every wafer
- CE marked