Chuck Cleaning Wafers & Probe/Test Clean
SiSTEM Technology offers a range of highly engineered cleaning materials from International Test Solutions (ITS). ITS products are used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (Chuck Cleaning Wafers - CCW).
Chuck Cleaning Wafers
A Chuck Cleaning Wafer is a wafer coated with proprietary engineered polymer film that can effectively removes particles on chuck without affecting tool uptime significantly.
Benefits of Chuck Cleaning Wafers:
- Tool uptime & cost improvement
- Reduce unplanned downtime due to contamination (increase yield)
- Process kit lifetime extension
- Reduced labour for maintenance
- Chambers back in production within minutes instead of hours
Problems solved by Chuck Cleaning Wafers:
- PVD: CCW solves the backside pressure fault problem caused by particles on the chuck. It also contributes to improvement of thin film uniformity
- Etch: CCW solves Helium leak problem caused by particles on the chuck
- Lithography: CCW solves the problem of hot spot, which causes defocus defect
Customers have managed to get higher Units per hour (UPH) by running Chuck Cleaning Wafers in Preventive Maintenance (PM) Mode.
You get to keep your equipment running 24/7 by running Chuck Cleaning Wafers in Preventive Maintenance (PM) Mode.
Litho, Implant, PVD, CVD and Etch are using Chuck Cleaning Wafers for DRAM and NAND as well as in logic & memory fabs.
STAGE CLEAN® was developed to remove and trap the loose debris that accumulates on the wafer chuck. Stage Clean is a highly cross-linked polymeric material that is mounted on a silicon wafer. The wafer is run polymer side down through the tool. The cleaning action of the polymer occurs when the wafer is clamped on the vacuum chuck. The compliant polymer not only removes defects from the top surface of the chuck, but also from crevices in the chuck, preventing those defects from getting on the backside of wafers.ETCH CLEAN® Eliminate Helium leaks due to particles on the electrostatic chuck without opening chamber.
Probe Card Clean
PROBE POLISH® Non-destructively maintains high wafer yield.
PROBE SCRUB® Restores performance and removes bonded debris.
PROBE LAP® Precision lapping film for probe needle cleaning.
PROBE LAP G-TYPE® Cushioned lapping film for reduced probe wear.
PROBE FORM® Reshapes probes for stable contact resistance.
Test Socket Clean
Sometimes called a surrogate cleaning device, or SCD, it facilitates frequent on-line socket cleaning without the need
for equipment downtime or operator intervention.
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