Cost Effective Equipment release Apogee™ 300 Bake Plate
The Apogee™ 300 is designed for process and R&D engineers requiring a bake plate for large-area substrate applications, and is capable of handling a maximum size of 300mm round or 14” square substrates.
BENEFITS
- New compact design for minimized footprint
- Full-color, 7-inch touch screen display
- Durable benchtop design that can be converted to a flange-/deck-mountable configuration
- Enhanced logging and optional programmable height control
- Hot plate cover that is cool to the touch, adding extra safety benefits
- Programmable exhaust
- Lift pins are now a standard inclusion
- DataStream™ technology as the standard interface
PROGRAMMABILITY
- Touch screen interface and display
- Virtually unlimited recipe storage
- Virtually unlimited steps per program
- Three automated bake methods: contact, vacuum, and proximity
- Bake plate auto-sizing: 100mm, 150mm, 200mm, and 300mm wafers
- Temperature data recording
- Electronic lift pins programmable in 0.1mm increments up to 13mm
- Password protection enabled
PRECISION
- Substrate sizes: 100mm, 150mm, 200mm, and 300mm round wafers
- Maximum substrate size of 14” (355.6mm) square substrate
- Temperature resolution: 0.1°C
- Temperature range: ambient to 300°C (400°C optional)
- Temperature uniformity: +/- 0.3% across working surface
RELIABILITY
- Exceptional uptime
- 1-year full warranty on parts and labor
- Free remote technical support (phone, email, fax) for the life of the product
- Application process assistance for the life of the product
EXHAUST BAKE HOOD DESIGN
- Unique 2-layer hood design reduces exterior hood temperature
- Exhausted hood for removal of process chemicals
- Optional Nitrogen purge for inert bake environments
DIMENSIONS
- 18” H x 18.75” W x 26.25” D
- Machine Weight: 146 lbs. (66.2 kg)
- Shipping Weight: 235 lbs. (106.6 kg)
UTILITIES
- Voltage ranges: 208-240 VAC
- Power requirements: 3100-4100 watts
- Exhaust port: 2” (50.8mm) OD
- Vacuum: 20 to 25 inches Hg (67.7 - 84.7 Pa)
- Exhaust: 5 to 10 cfm (141.6 - 283.2 1/min)
- N2 (for bake plate proximity): 35 psi (241.3 Pa)



DATASTREAM™ TECHNOLOGY: CONNECTING THE SEMICONDUCTOR INDUSTRY
Cee® has released DataStream™ technology on its new Apogee™ tool line. DataStream™ technology gives you access to all of your connected Apogee™ manufacturing equipment in one place to track, access, and modify your systems via a website or mobile app. This technology will give manufacturers the ability to process and visualize data in real time and search and export that data into a number of different formats.
Real-Time Process Information
- Constant feedback of process information for monitoring critical process parameters
- Streamlined interface between different tool types
- Visual cues on process status & health
Advanced Recipe Creation
- Seamless switching between basic and advanced recipe creation methods
- Plain-English recipe translation
- Pre-defined process commands
- Unlimited process steps
- Unlimited recipe storage
Environmental Monitoring
- Monitoring of temperature & humidity allows for stricter control of critical processes
- Set preconditions and tolerances for monitored parameters
- On-screen, colored visual cues for deviation from controlled specs
Data Logging & Export
- Export data logs into commonly readable formats for further analysis and process troubleshooting
- Increase process efficiency
- Identify process control deviations
- Analyze multiple processes for best known method (BKM) development