SIO-300-200 Thermal Curing System
Automated curing at up to 250°C
The SIO-300-200 is a fully automatic curing system for 200mm and 300mm wafers. One enclosure holds the curing chambers, 300mm load ports, a wafer robot, a cassette robot and the controls, inside a mini-environment. It cures in nitrogen from ambient to 250°C, heating gently so the wafer surface doesn’t overheat, and 200mm cassettes can be loaded by hand or automatically.
SiSTEM is Fortrend’s distributor for the UK, Ireland and Europe, and our engineers install and service the system on site.
Uses
3DIC profile curing, photoresist baking, moisture removal, reflow and anneal.
Two configurations
- SIO-300-200-4: two ovens, vertical wafers, a single-arm wafer robot and a cassette robot, four load ports and three cool stations
- SIO-300-200-5H: four ovens, horizontal wafers, a dual-arm robot with a 1+5 blade end effector, four load ports and four cool stations
Specification
- Ambient to 250°C, uniformity ±3.5°C
- Class 10 curing chamber, with the system as a whole cleaner than Class 10
- Nitrogen process gas, 0 to 50 L/min
- Programmable recipes, and wafer and arm protrusion detection
- Windows 10 or later IPC controller
- Curing chambers to SEMI S2 and S8
To quote we’ll ask about
- Wafer sizes, and FOUP or cassette loading
- The materials and cure profiles, including peak temperature and time
- Throughput, and vertical or horizontal wafers
