FVO-450 Vacuum Curing Oven
High-temperature vacuum curing
The FVO-450 cures 200mm and 300mm wafers under vacuum and nitrogen from 50°C to 450°C. Each chamber holds 50 wafers, and the FVO-450-2 stacks two chambers for 100. FOUP openers and a dual-arm SCARA robot load the chambers automatically, with two openers on the single-chamber system and four on the dual. The system follows SEMI GEM300 for factory automation, with E84 for OHT delivery and RFID as standard.
Laminar airflow and continuous pumping remove solvent evenly and carry effluents away through the whole cycle, which keeps particles down. Oxygen stays below 10 ppm with nitrogen purge, and Fortrend quotes an 80% saving in nitrogen from its air-cooled design.
SiSTEM is Fortrend’s distributor for the UK, Ireland and Europe, and our engineers install and service the system on site.
Uses
Polyimide and BCB cure, photoresist cure, copper anneal and copper oxide removal, 2.5D and 3DIC profile curing, reflow and moisture removal.
Specification
- 50°C to 450°C
- Chamber pressure down to 10 torr
- Oxygen under 10 ppm with nitrogen purge
- Uniformity better than ±2°C up to 250°C and ±1% above, at dwell after stabilisation, measured with five thermocouples per wafer
- EFEM ISO Class 3 and oven Class 10 (ISO Class 4), with fan filter units rated 99.9995% at 0.12µm
- FVO-450-1: one chamber and two FOUP openers. FVO-450-2: two chambers, four FOUP openers and a robot track
- E84, RFID at 134.2kHz (IR or barcode optional), GEM300
- 30-minute UPS for the controller
To quote we’ll ask about
- The materials and cure profiles, including peak temperature, ramp and dwell
- Wafer size and how many wafers per day
- Facilities: power, nitrogen, vacuum and exhaust
