Nanoquest III/IV Ion Beam Etch & Milling
The Intlvac Nanoquest III is a batch ion beam etching system for production. It controls ion beam energy and etch angle automatically, for processes from simple inert etching to complex reactive etching, in a cleanroom setting. It’s used for precision etching of noble metals and other hard-to-etch thin films, with even patterning across each substrate.
Batch stage
Up to three platens ride on a water-cooled, double-axis stage with flat-plate planetary motion. Substrate rotation and an adjustable stage angle keep the etch even and clear secondary redeposition from sidewalls. The platens are water-cooled directly, and cooling channels welded in a web pattern across the chamber act as a heat sink.
Ion source
The 22 cm RF ion source delivers more than 1 A of beam current across 100 to 1500 eV. It’s filamentless, with self-aligning molybdenum optics and a frequency-matched RF power supply.
End point detection
An optional secondary ion mass spectrometry (SIMS) end point system uses a triple-filter quadrupole covering 300 amu, with less than ±0.5% signal height variation over 24 hours.
Control
A PLC runs the system through Intlvac’s LabVIEW graphical interface, with pump-down and venting automated by the AutoVac controller and every process parameter in one place.
There’s more on the technique on our ion beam etching and milling page.
Working with SiSTEM
SiSTEM is Intlvac’s partner for the UK, Ireland and most of Europe. We scope your system with you and Intlvac’s engineers, and stay your local contact through quotation, installation and after-sales. Tell us your batch size and the materials you need to etch, and we’ll take it to Intlvac.
