- Substrates from 50mm to 200mm
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As semiconductor geometries continue to shrink and device complexity grows, achieving exceptional cleanliness has become a cornerstone of successful fabrication. Megasonics, a high-frequency acoustic cleaning technology, has emerged as a vital solution in the fight against submicron contamination. With its ability to deliver uniform, non-contact cleaning across a wide variety of substrates, megasonic technology is redefining standards in semiconductor, photonics, MEMS, and advanced packaging processes.
At SiSTEM Technology, we supply advanced megasonic systems that meet the growing demands of next-generation manufacturing environments. From single-wafer applications to tank-based cleaning systems, our megasonic solutions deliver the precision, reliability, and repeatability required for today’s most challenging process requirements.
Megasonics refers to the use of ultrasonic sound waves in the 700 kHz to 2 MHz range to agitate liquid cleaning solutions. These high-frequency waves generate microscopic cavitation bubbles in the fluid. Unlike traditional ultrasonics (20–100 kHz), which produce violent bubble collapse, megasonics creates gentler, more controlled cavitation that is ideal for cleaning delicate surfaces without causing damage.
When the sound waves interact with a cleaning fluid, they produce zones of high and low pressure. During the low-pressure phase, small vapour bubbles form in the fluid. These bubbles collapse during the high-pressure phase, releasing energy that dislodges particles, residues, and contaminants from the surface of the substrate. The result is a non-destructive, highly effective cleaning method capable of reaching microscopic features on advanced device architectures.
In modern fabs, conventional brush scrubbing and chemical cleaning alone are no longer sufficient to meet cleanliness requirements. Devices with deep trenches, narrow vias, and 3D structures demand a cleaning method that ensures both surface and sub-surface purity. Megasonics addresses this challenge by:
These advantages make megasonics an ideal choice for processes such as post-CMP cleaning, lift-off, resist stripping, mask cleaning, pre-plating preparation, and etch assist—among many others.
Megasonics can be deployed in both single-wafer and batch tank configurations. At SiSTEM Technology, we offer a portfolio of systems to support both approaches.
A key consideration in megasonic cleaning is materials compatibility. Our range includes resonators made from sapphire, quartz, and stainless steel, each selected for specific process chemistries and performance attributes:
Innovations such as patented crystal-to-resonator bonding, RF connectivity, and redundant RTD temperature monitoring further enhance the reliability, acoustic efficiency, and process control of our systems.
One of the standout benefits of megasonics is its ability to significantly reduce process chemical usage. By enhancing the mechanical action of the cleaning fluid through acoustic energy, less chemistry is required to achieve optimal results. This contributes not only to lower operating costs but also to reduced environmental impact—a growing priority across all high-tech manufacturing sectors.
Megasonics also lowers energy consumption when compared to indirect acoustic methods, with some systems offering up to 60% power savings without sacrificing cleaning uniformity.
SiSTEM Technology partners with leading global suppliers to bring best-in-class megasonic cleaning solutions to customers across the UK, Ireland, and the rest of Europe. Our product range includes:
Whether you’re scaling up production, developing new cleaning recipes, or retrofitting existing systems, SiSTEM Technology can help you integrate precision megasonic technology to meet your process goals.
Contact us today for more information.