Nanoquest II Ion Beam Etch & Milling
The Intlvac Nanoquest II is an ion beam etching system for microfabrication, photonics and materials research, built on a stainless steel UHV platform with active thermal management. Intlvac lists it for MEMS, lithium niobate devices, photonic waveguides, quantum computing components, and IC delayering and failure analysis.
Ion source
A 22 cm RF inductively coupled plasma (ICP) ion source gives ion energies from 100 to 1200 eV, with beam currents above 1 A. Ion energy, current density and incidence angle are each set directly, so a process can be tuned for high aspect ratio and selectivity on masked wafers, or for even planarisation of a surface with mixed topography.
Stage and uniformity
The water-cooled stage takes substrates up to 100 mm in diameter, rotating at 0 to 30 rpm and tilting through ±90°. Intlvac quotes ±3% in-plane uniformity over a 100 mm substrate and ±2% repeatability wafer to wafer.
Load lock camera
A self-illuminating microscope camera looks into the load lock without breaking vacuum. On a precision XY stage with vibration control, it resolves features down to 1 µm.
End point detection
In-situ end point detection uses secondary ion mass spectrometry (SIMS), with a triple-filter quadrupole mass spectrometer covering 300 amu, to a resolution of ±5 Å.
Working with SiSTEM
SiSTEM is Intlvac’s partner for the UK, Ireland and most of Europe. We scope your system with you and Intlvac’s engineers, and stay your local contact through quotation, installation and after-sales. Tell us your substrate sizes and the materials you need to etch, and we’ll take it to Intlvac.
