Temporary Bond & Debond

Wafer bonding is a process used in photolithography and semiconductor manufacturing to join two wafers of semiconductor material together. The process involves bringing two wafers into close contact and applying heat, pressure, or an electric field to bond them together.

Once all processing is complete, the wafer de-bonder is used to remove the wafer from the substrate. The wafer de-bonder uses a combination of heat and solvents to dissolve the temporary adhesive and release the wafer from the substrate.