Temporary Bond & Debond

Cee® Temporary Bonders and Debonders are used around the world for small volume production in the fab and critical process development in the lab. These tools are designed and built with wafer and device yield in mind. Rapidly implement a temporary bonding and debonding process with expert knowledge in an integrated solution.

Cee® Temporary Bonders and Debonders are used around the world for small volume production in the fab and critical process development in the lab. These tools are designed and built with wafer and device yield in mind. Rapidly implement a temporary bonding and debonding process with expert knowledge in an integrated solution.

The Cee® 1300CSX Thermal Slide Debonder is a production fab ready, semi-automated tool.  It uses dual heated platens to soften adhesives or waxes in a bonded wafer pair to their melting point and then applies precisely controlled forces to slide the carrier and device wafers apart.  Temperatures, positions, forces and speeds are recipe controlled with full logging of each wafer process.

These tools are primarily used for small volume compound semiconductor and thinned silicon production fabs where precise control is required to maintain yields and device performance.  Because the 1300CSX does not use robots to load and unload wafers, footprint and cost is dramatically reduced, and flexibility to work with multiple wafer sizes is enhanced.

The Apogee™ Mechanical Debonder is the newest generation Debonder for small volume production, and research and development applications.  Coupled with appropriate bonding adhesive materials, the process works by holding the device wafer on a film frame against a flat surface and gently peeling the carrier away with precisely controlled forces.

Advantages include minimised stresses on the device wafer, high throughput, and room temperature operation allowing the use of very high temperature adhesives for post bond processing.  Unlike solvent debond processes, there are no messy solvents and the device wafer remains attached to the film frame throughout the process, so no more lost devices.

The debond process is fully programmable and automated leaving operator interaction limited to simply loading bonded pairs and unloading the de-bonded device and carrier wafers.  As with other CEE® tools, the Apogee Mechanical Debonder provides the performance of a track-system without the hassle, footprint, and cost.  DataStream™ technology provides real-time network access, remote monitoring and logging of all critical parameters.