Dicing Tape - UV and Non-UV
Dicing tape for silicon, glass and packaging substrates
D&X dicing tape holds a wafer or substrate on its frame while it’s cut, then releases the dies cleanly for pick-up. D&X makes it in Japan in UV and non-UV types, and designs it to expand evenly, reduce chipping, prevent whiskers and leave no adhesive residue. Our wafer dicing and back-grinding tape page explains how to choose between UV and non-UV.
Tapes for silicon wafers
The silicon tapes are thin PVC-based films with acrylic adhesive. DX-TAD85C-R-X prevents chipping and supports small chips; DX-TAD95C is transparent and highly expandable; DX-TAD95C-AS adds antistatic properties and RoHS 2.0 compliance.
Tapes for glass, ceramics and packaging substrates
Harder and uneven surfaces take PET, PO or EVA base films with stronger adhesives, up to 40,000 mN/25 mm before UV. DX-TAB165C is designed to prevent chipping and peels easily by hand.
| Tape | Use | Thickness (µm) | Base / adhesive (µm) | Adhesion before / after UV (mN/25 mm) |
|---|---|---|---|---|
| DX-TAD85C-R-X | Silicon wafer | 85 | PVC 70 / acrylic 15 | 6,500 / 260 |
| DX-TAD95C | Silicon wafer | 95 | PVC 80 / acrylic 15 | 3,000 / 150 |
| DX-TAD95C-AS | Silicon wafer, antistatic | 95 | PVC 80 / acrylic 15 | 2,900 / 150 |
| DX-TAU115 | Glass, ceramics | 115 | PET 100 / acrylic 15 | 19,000 / 100 |
| DX-TAU125B | Packaging substrates | 125 | PET 100 / acrylic 25 | 30,000 / 150 |
| DX-TAU213F | Packaging substrates | 213 | PET 188 / acrylic 25 | 40,000 / 170 |
| DX-TAP100 | Packaging substrates, glass | 100 | PO 90 / acrylic 10 | 6,300 / 180 |
| DX-TAP165 | Packaging substrates, glass | 165 | PO 150 / acrylic 15 | 19,000 / 180 |
| DX-TAP200 | Packaging substrates, glass | 200 | PO 150 / acrylic 50 | 23,000 / 200 |
| DX-TAB165C | Packaging substrates | 165 | EVA 150 / acrylic 15 | 15,000 / 140 |
The full list, including non-UV and further packaging grades, is in the D&X tape list below. Width, length, thickness, hardness and adhesion can be specified to suit your process.
Key features and benefits
- UV and non-UV types
- Tapes for silicon, glass, ceramics and packaging substrates
- Even expansion for die separation
- Designed to reduce chipping and prevent whiskers
- No adhesive residue
- Antistatic and RoHS 2.0 compliant options
- Made in Japan, inspection sheet with every shipment
- Short rolls to full production quantities
To ask for samples or a quotation, contact us or request a quote.
