microPRO XS Compact Laser Micromachining System

microPRO XS: compact laser micromachining for production and research

The 3D-Micromac microPRO XS is a compact, configurable laser micromachining system. 3D-Micromac builds it for industrial production and also for product development and applied research, and pitches it on flexibility and cost efficiency. It handles structuring, cutting, drilling and welding on metals, alloys, transparent and biological materials, ceramics and thin-film compound systems. Its configuration packages include ohmic contact formation, the process the dedicated microPRO XS OCF system is built for. It’s one of the laser micromachining processes we support for research and development and semiconductor customers.

Configuration packages

Packages include cutting, drilling, engraving, structuring and modification, ohmic contact formation and customised solutions. The system is prepared for one laser source, from nanosecond, fibre, femtosecond, picosecond or CO2, delivered through 2D or 3D galvo scanners or fixed optics, with power measured at workpiece level.

Precision and working area

A direct-driven XY positioning system gives 300 x 200 mm of travel, with positioning accuracy of ± 15 µm and repeatability of ± 5 µm. Substrates up to 200 x 200 mm fit the free-configurable working area, and larger sizes are available on request. Z positioning is automatic depending on the configuration, and alignment can be manual, semi-automated or fully automated with an optical measurement system on request.

A smaller footprint

The microPRO XS measures 2,444 x 920 x 2,100 mm and weighs approximately 1.2 t, against 3,010 x 1,490 x 2,270 mm and approximately 4 t for the larger microPRO. It runs the same microMMI software, with separate user levels and DXF, CSV, Gerber and CLI input, and sits in a laser class 1 housing with active exhaust. Automatic handling is available on request.

Key features and benefits

• Compact system for production, product development and applied research
• One laser source chosen from ns, fibre, fs, ps or CO2
• Configuration packages for cutting, drilling, engraving, structuring and ohmic contact formation
• 300 x 200 mm travel, ± 15 µm positioning accuracy, ± 5 µm repeatability
• Substrates up to 200 x 200 mm, larger on request
• Quick-change workpiece clamping
• microMMI software with DXF, CSV, Gerber and CLI input
• 2,444 x 920 x 2,100 mm, approx. 1.2 t

To discuss your process or arrange trials at 3D-Micromac’s application laboratory in Chemnitz, contact us or request a quote.