P9000-30 Frame Processing System
Coating and cleaning wafers on tape frames
The P9000-30 coats wafers mounted on dicing tape frames with a resist or polymer before sawing or laser scribing. After dicing it cleans the wafer and removes the protective coat from both the wafer and the frame. C&D’s counter-balanced chuck carries the combined weight of frame and wafer safely, supports sawn substrates and stops small die being pulled down by the vacuum. It has a record of handling sawn wafers 50 µm thick on large frames.
SiSTEM is C&D’s distributor for the UK and Ireland: we specify and quote the system with you, and our after-sales team installs and supports it.
Processes
- Protective layer coating before dicing, including laser and plasma dicing
- Protective layer removal after dicing
- Frame cleaning after coating and again after dicing
- Solvent or caustic cleans, with an optional ammonia-peroxide clean after dicing
- Nitrogen blow-off after the final rinse
Hardware
Two dispense arms carry up to eight different fluids, through stream, fan spray and atomised spray nozzles. The atomised spray has the force to break up the protective coat after dicing. An ionising unit treats the DI water. The quick-change chuck suits different wafer and frame sizes and can be made in several materials to suit the process. Heated chemicals and automatic chuck cleaning are options.
Manual or automatic
The P9000-30 comes as a manual system or with a central atmospheric robot moving frames cassette to cassette, with cassette mapping. Both take most common frame sizes, and the automatic version takes most common cassettes. C&D also builds frame tracks for HOOP ring frames.
System
smartPro Windows software, barcode and recipe download, and SECS/GEM as an option. CE marked.
To quote frame processing we’ll ask about
- Frame and wafer sizes, and wafer thickness
- The protective coat you use, and the dicing method
- Manual or automatic loading
- Throughput
