Applications

Atomic Layer Deposition

Atomic Layer Deposition

State-of-the-art ALD systems for research and development through to full scale production. Includes the Plasma Enhanced ALD (PEALD), Roll-To-Roll ALD systems, Powder Coating ALD systems & Vacuum Cluster tools.
Atomic Layer Deposition

Atomic Layer Deposition

State-of-the-art Atomic Layer Deposition (ALD) thin film coating solutions from fully automated, SEMI-compliant batch and cluster systems for high volume manufacturing, to smaller scale R&D and pre-pilot production tools. Tools for Plasma Enhanced ALD (PEALD), 3D, Roll-To-Roll ALD, Powder Coating ALD.

Thin Flim

Indium Bump Deposition | Diamond-Like Carbon (DLC) | Ion Beam Etching & Sputtering | RF, AC & Planar Magnetron Sputtering |Electron Beam Evaporation | Thermal Evaporation | Ion Beam-Assisted Evaporation.
Thin Film Evaporation Sputtering, Ion Beam Etch, PECVD
 Handling & Automation

Inkjet Printing For Functional Materials

Notion Systems relies on decades of expertise, bringing precise inkjet systems to clients, and scaling up digital printing processes from laboratory to industrial production.

Automated Optical Inspection

Optical inspection systems for the world’s most advanced technologies: semiconductors, microchips, hard drives, LEDs, aerospace hardware, nano-fillers, nanotubes, nano-medicine, and more.
Thin Film Evaporation Sputtering, Ion Beam Etch, PECVD
Spin, coat, develop, bake & clean tools, Bonder & De-Bonders

Microelectronics Testing

Your partner for zero defect achievement. Reliability testing solutions for Logic, MEMS, Memory and Smart Power ICs, Sic & GaN and Photonics.

Wafer & Mask/Reticle Handling & Automation

Wafer & Mask/Reticle Handling/Sort Systems | Mass Wafer Transfer Systems | SMIF Pod/De-Pod | Sorters | EFEMs | RFID Tracking Systems | 300mm AGV/Stocker | 450mm FOUP & EUV Pod Openers.
 Handling & Automation
Spin, coat, develop, bake & clean tools, Bonder & De-Bonders

Spin, Coat, Develop, Bake & Clean

Born out of Brewer Science, Cost Effective Equipment (CEE) is a leader in high precision wafer process instruments for demanding applications, offering the maximum in flexibility and reliability.

Temporary Bond & Debond

Cee® Temporary Bonders and Debonders are used around the world for small volume production in the fab and critical process development in the lab. These tools are designed and built with wafer and device yield in mind. Rapidly implement a temporary bonding and debonding process with expert knowledge in an integrated solution.
Spin, coat, develop, bake & clean tools, Bonder & De-Bonders
Wet processing, Chemical Heaters and Megasonics

Wet Processing & Chemical Heaters

Manual/Semi-Auto and Fully-Automated Wet Stations | Chemical Distribution Systems | In-Line & Immersion Chemical Heaters | Ultra-Pure DI Water Heaters.

Thermal Processing

Horizontal R & D and Production Furnaces | Horizontal and Vertical Furnace Elements | Insulation and Vestibule Blocks | Astra Furnace Controller | Vacuum & Convection Ovens.
 Thermal Processing
Megasonics

Megasonics

Stainless, quartz or kynar direct-coupled megasonic tank systems. Custom immersible megasonic trays, for both single wafer and batch cleaning, to solve a variety of difficult contamination-sensitive cleaning issues.

Vacuum

Vacuum Inlet Traps | Vacuum Pump Accessories | Degassing Systems.
Vacuum
Spin, coat, develop, bake & clean tools, Bonder & De-Bonders

FFKM & FKM O-Rings & Seals

Probe, Test & Burn-In

Chuck Cleaning Wafers | Probe Needle/Socket Cleaning
Probe, Test & Burn-in
Megasonics

Megasonics

Using high-frequency acoustic energy, our advanced megasonics technology enables tighter control over substrate cleaning processes making them faster and more efficient.
We offer a wide range of solutions for both single wafer and batch cleaning including custom system designs to solve a variety of difficult contamination-sensitive cleaning issues.
Probe, Test & Burn-in

Probe, Test & Burn-in

Probe & Test: Epoxy & blade probe cards, probe needle/socket cleaning, chuck cleaning wafers. Vacuum Traps: High capacity vacuum inlet traps, foreline traps, oil mist eliminators, Oil Filtration & Vacuum Degassing systems. Intelligent Fluid: Water based cleaning fluids for catch cup cleaning, resist stripping and lift-off
Resist strip cleaning

Resist strip cleaning

Intelligent fluids GmbH has developed cleaning fluids which can remove persistent pollutants and organic materials in the microelectronic sector.
Spin, coat, develop, bake & clean tools, Bonder & De-Bonders

Spin, Coat, Develop, Bake & Clean

Born out of Brewer Science, Cost Effective Equipment (CEE) is a leader in high precision wafer process instruments for demanding applications, offering the maximum in flexibility and reliability.

SiSTEM Technology Limited
Grafton Suite
Caswell Science & Technology Park
Towcester
Northamptonshire
NN12 8EQ
United Kingdom

Email:
sales@sistemtechnology.com

Telephone:
+44 (0)1327 317 621

Get in touch