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- Advanced Electron Beam Evaporation
- Direct Water-Cooled Rotating Substrate Stage
- Automatic Variable Angle Deposition
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Equipment used to create thin films is essential in the semiconductor industry, as these films serve as the foundation for a variety of electronic devices, such as integrated circuits, solar cells, and displays. Thin film deposition equipment is designed to deposit materials with precision and uniformity on substrates, enabling manufacturers to produce high-quality components that power modern technology.
There are several thin film deposition techniques, each with its own specialised equipment. Some of the most widely used methods include:
Physical Vapour Deposition (PVD): PVD equipment, such as sputtering and evaporation systems, utilizes physical processes to deposit thin films by condensing vaporized materials onto the substrate.
Chemical Vapour Deposition (CVD): CVD equipment deposits thin films through chemical reactions involving gas-phase precursors. Common CVD techniques include plasma-enhanced CVD (PECVD), low-pressure CVD (LPCVD), and atomic layer deposition (ALD).
Electrochemical Deposition: This technique uses electrochemical processes to deposit thin films, often employed in the fabrication of semiconductor devices and MEMS.
Atomic Layer Deposition (ALD): ALD equipment enables highly precise and conformal deposition by using alternating self-limiting chemical reactions to build layers one atom at a time.
Each deposition technique offers unique advantages in terms of film quality, conformality, and process control, making them suitable for various applications within the semiconductor industry. By employing advanced thin film deposition equipment, manufacturers can continue to innovate and drive the development of increasingly powerful electronic devices.
Superior PVD Deposition Capability
Large Multi-Target Carousel
Rotating and Angle-Tilt Substrate Stage
Ion Assist Capability and Monitoring
High-Density Coatings with Low Particle Levels